AM29F160DT55FI0
vs
MBM29DL161BE-90TN
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
FUJITSU SEMICONDUCTOR AMERICA INC
Part Package Code
TSOP
TSOP1
Package Description
SOP,
PLASTIC, TSOP1-48
Pin Count
48
48
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
55 ns
90 ns
Additional Feature
CONFG AS 1M X 16; 1000K WRITE CYCLES MIN; DATA RETENTION 20 YEARS; TOP BOOT BLOCK
Boot Block
TOP
BOTTOM
Data Retention Time-Min
20
JESD-30 Code
R-PDSO-G48
R-PDSO-G48
Memory Density
16777216 bit
16777216 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
16
Number of Functions
1
1
Number of Terminals
48
48
Number of Words
2097152 words
1048576 words
Number of Words Code
2000000
1000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
2MX8
1MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
TSOP1
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE, THIN PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
5 V
3 V
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
3.6 V
Supply Voltage-Min (Vsup)
4.5 V
2.7 V
Supply Voltage-Nom (Vsup)
5 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Position
DUAL
DUAL
Type
NOR TYPE
NOR TYPE
Base Number Matches
1
1
Alternate Memory Width
8
Length
18.4 mm
Seated Height-Max
1.2 mm
Terminal Pitch
0.5 mm
Width
12 mm
Compare AM29F160DT55FI0 with alternatives
Compare MBM29DL161BE-90TN with alternatives