AM29F080-120FIB
vs
LH28F008SCR-V12
feature comparison
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
SHARP CORP
|
| Reach Compliance Code |
compliant
|
unknown
|
| Base Number Matches |
3
|
1
|
| Package Description |
|
10 X 20 MM, 1.2 MM HEIGHT, REVERSE, TSOP-40
|
| Access Time-Max |
|
120 ns
|
| JESD-30 Code |
|
R-PDSO-G40
|
| JESD-609 Code |
|
e6
|
| Length |
|
18.4 mm
|
| Memory Density |
|
8388608 bit
|
| Memory IC Type |
|
FLASH
|
| Memory Width |
|
8
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
40
|
| Number of Words |
|
1048576 words
|
| Number of Words Code |
|
1000000
|
| Operating Temperature-Max |
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
|
1MX8
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
TSOP1-R
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE, THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Programming Voltage |
|
5 V
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
1.2 mm
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
COMMERCIAL
|
| Terminal Finish |
|
TIN BISMUTH
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.5 mm
|
| Terminal Position |
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
| Width |
|
10 mm
|
|
|
|
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