AM29F040-90DEB
vs
AM29F040-90DI
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
ADVANCED MICRO DEVICES INC
Part Package Code
DIP
DIP
Package Description
CERAMIC, DIP-32
HERMETIC SEALED, CERAMIC, DIP-32
Pin Count
32
32
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
90 ns
90 ns
Additional Feature
BULK ERASE; EMBEDDED ALGORITHM
BULK ERASE; AUTOMATIC WRITE
Command User Interface
YES
Data Polling
YES
Endurance
100000 Write/Erase Cycles
JESD-30 Code
R-GDIP-T32
R-GDIP-T32
JESD-609 Code
e0
Length
42.1005 mm
42.1005 mm
Memory Density
4194304 bit
4194304 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Sectors/Size
8
Number of Terminals
32
32
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Organization
512KX8
512KX8
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP32,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
5 V
5 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.588 mm
5.588 mm
Sector Size
64K
Standby Current-Max
0.0001 A
Supply Current-Max
0.06 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Toggle Bit
YES
Type
NOR TYPE
NOR TYPE
Width
15.24 mm
15.24 mm
Base Number Matches
1
1
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Compare AM29F040-90DI with alternatives