AM29F010B-120DGC1 vs AS29F010CW-120/Q feature comparison

AM29F010B-120DGC1 Spansion

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AS29F010CW-120/Q Micross Components

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SPANSION INC MICROSS COMPONENTS
Part Package Code DIE DIP
Package Description DIE-30 DIP, DIP32,.6
Pin Count 30 32
Reach Compliance Code compliant compliant
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 120 ns 120 ns
JESD-30 Code R-XUUC-N30 R-CDIP-T32
JESD-609 Code e0
Memory Density 1048576 bit 1048576 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 30 32
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 128KX8 128KX8
Package Body Material UNSPECIFIED CERAMIC, METAL-SEALED COFIRED
Package Code DIE DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style UNCASED CHIP IN-LINE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 5 V 5 V
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish TIN LEAD
Terminal Form NO LEAD THROUGH-HOLE
Terminal Position UPPER DUAL
Type NOR TYPE NOR TYPE
Base Number Matches 1 1
Command User Interface YES
Data Polling YES
Endurance 1000000 Write/Erase Cycles
Length 41.7322 mm
Number of Sectors/Size 8
Package Equivalence Code DIP32,.6
Peak Reflow Temperature (Cel) NOT SPECIFIED
Screening Level MIL-PRF-38535 Class Q
Seated Height-Max 5.1308 mm
Sector Size 16K
Standby Current-Max 0.0016 A
Supply Current-Max 0.05 mA
Terminal Pitch 2.54 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Toggle Bit YES
Width 15.24 mm

Compare AM29F010B-120DGC1 with alternatives

Compare AS29F010CW-120/Q with alternatives