AM29F002BB-55JI
vs
MBM29F002BC-55PD
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
SPANSION INC
|
FUJITSU SEMICONDUCTOR AMERICA INC
|
| Part Package Code |
LCC
|
QFJ
|
| Package Description |
PLASTIC, MO-052AAE, LCC-32
|
PLASTIC, LCC-32
|
| Pin Count |
32
|
32
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Access Time-Max |
55 ns
|
55 ns
|
| Additional Feature |
BOTTOM BOOT BLOCK
|
100000 WRITE/ERASE CYCLES MIN
|
| Boot Block |
BOTTOM
|
BOTTOM
|
| Command User Interface |
YES
|
|
| Data Polling |
YES
|
|
| Endurance |
1000000 Write/Erase Cycles
|
|
| JESD-30 Code |
R-PQCC-J32
|
R-PQCC-J32
|
| JESD-609 Code |
e0
|
|
| Length |
13.97 mm
|
13.97 mm
|
| Memory Density |
2097152 bit
|
2097152 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
8
|
8
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
1
|
| Number of Sectors/Size |
1,2,1,3
|
|
| Number of Terminals |
32
|
32
|
| Number of Words |
262144 words
|
262144 words
|
| Number of Words Code |
256000
|
256000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
-20 °C
|
| Organization |
256KX8
|
256KX8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
QCCJ
|
| Package Equivalence Code |
LDCC32,.5X.6
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Programming Voltage |
5 V
|
5 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.556 mm
|
3.56 mm
|
| Sector Size |
16K,8K,32K,64K
|
|
| Standby Current-Max |
0.000005 A
|
|
| Supply Current-Max |
0.04 mA
|
|
| Supply Voltage-Max (Vsup) |
5.25 V
|
5.25 V
|
| Supply Voltage-Min (Vsup) |
4.75 V
|
4.75 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
J BEND
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Toggle Bit |
YES
|
|
| Type |
NOR TYPE
|
NOR TYPE
|
| Width |
11.43 mm
|
11.43 mm
|
| Base Number Matches |
4
|
4
|
|
|
|
Compare AM29F002BB-55JI with alternatives
Compare MBM29F002BC-55PD with alternatives