AM29DS324GB90WMFN vs AM29DS322GB90WMI feature comparison

AM29DS324GB90WMFN Spansion

Buy Now Datasheet

AM29DS322GB90WMI Cypress Semiconductor

Buy Now Datasheet
Rohs Code Yes No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer SPANSION INC CYPRESS SEMICONDUCTOR CORP
Part Package Code BGA
Package Description 6 X 12 MM, 0.80 MM PITCH, FBGA-48
Pin Count 48
Reach Compliance Code compliant compliant
ECCN Code EAR99
HTS Code 8542.32.00.51
Access Time-Max 90 ns 90 ns
Alternate Memory Width 8 8
Boot Block BOTTOM BOTTOM
JESD-30 Code R-PBGA-B48 R-PBGA-B48
JESD-609 Code e1
Length 12 mm
Memory Density 33554432 bit 33554432 bit
Memory IC Type FLASH FLASH
Memory Width 16
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 48 48
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 2MX16 2MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA FBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 1.8 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm
Supply Current-Max 0.025 mA 0.025 mA
Supply Voltage-Max (Vsup) 2.2 V
Supply Voltage-Min (Vsup) 1.8 V
Supply Voltage-Nom (Vsup) 2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Type NOR TYPE NOR TYPE
Width 6 mm
Base Number Matches 1 3
Command User Interface YES
Common Flash Interface YES
Data Polling YES
Number of Sectors/Size 8,63
Package Equivalence Code BGA48,6X8,32
Power Supplies 1.8/2.2 V
Ready/Busy YES
Sector Size 8K,64K
Standby Current-Max 0.000005 A
Toggle Bit YES

Compare AM29DS324GB90WMFN with alternatives