AM29DS322GT70WMIN
vs
AM29DS320GB70WMIN
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
CYPRESS SEMICONDUCTOR CORP
|
Reach Compliance Code |
compliant
|
compliant
|
Access Time-Max |
70 ns
|
70 ns
|
Alternate Memory Width |
8
|
8
|
Boot Block |
TOP
|
BOTTOM
|
Command User Interface |
YES
|
YES
|
Common Flash Interface |
YES
|
YES
|
Data Polling |
YES
|
YES
|
JESD-30 Code |
R-PBGA-B48
|
R-PBGA-B48
|
Memory Density |
33554432 bit
|
33554432 bit
|
Memory IC Type |
FLASH
|
FLASH
|
Number of Sectors/Size |
8,63
|
8,63
|
Number of Terminals |
48
|
48
|
Number of Words |
2097152 words
|
2097152 words
|
Number of Words Code |
2000000
|
2000000
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
2MX16
|
2MX16
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
FBGA
|
FBGA
|
Package Equivalence Code |
BGA48,6X8,32
|
BGA48,6X8,32
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, FINE PITCH
|
GRID ARRAY, FINE PITCH
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Power Supplies |
1.8/2.2 V
|
2 V
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Ready/Busy |
YES
|
YES
|
Sector Size |
8K,64K
|
8K,64K
|
Standby Current-Max |
0.000005 A
|
0.000005 A
|
Supply Current-Max |
0.025 mA
|
0.025 mA
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Toggle Bit |
YES
|
YES
|
Type |
NOR TYPE
|
NOR TYPE
|
Base Number Matches |
3
|
3
|
Supply Voltage-Nom (Vsup) |
|
2 V
|
|
|
|