AM29DL800BB90WBD
vs
AM29LV800DB-90WCI
feature comparison
All Stats
Differences Only
Rohs Code
Yes
No
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
SPANSION INC
CYPRESS SEMICONDUCTOR CORP
Part Package Code
BGA
Package Description
6 X 9 MM, 0.80 MM PITCH, LEAD FREE, FBGA-48
Pin Count
48
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8542.32.00.51
Access Time-Max
90 ns
90 ns
Additional Feature
BOTTOM BOOT BLOCK
Alternate Memory Width
8
8
Boot Block
BOTTOM
BOTTOM
Command User Interface
YES
YES
Data Polling
YES
YES
JESD-30 Code
R-PBGA-B48
R-PBGA-B48
JESD-609 Code
e1
Length
9 mm
Memory Density
8388608 bit
8388608 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
Moisture Sensitivity Level
3
Number of Functions
1
Number of Sectors/Size
2,4,2,14
1,2,1,15
Number of Terminals
48
48
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
512KX16
512KX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
FBGA
Package Equivalence Code
BGA48,6X8,32
BGA48,6X8,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
Programming Voltage
3 V
Qualification Status
Not Qualified
Not Qualified
Ready/Busy
YES
YES
Seated Height-Max
1.2 mm
Sector Size
16K,8K,32K,64K
16K,8K,32K,64K
Standby Current-Max
0.000005 A
0.000005 A
Supply Current-Max
0.045 mA
0.03 mA
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
Supply Voltage-Nom (Vsup)
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
Toggle Bit
YES
YES
Type
NOR TYPE
NOR TYPE
Width
6 mm
Base Number Matches
2
3
Endurance
1000000 Write/Erase Cycles
Power Supplies
3/3.3 V
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