AM29DL800B-150UAE vs AM29LV800BT90WBE feature comparison

AM29DL800B-150UAE Spansion

Buy Now Datasheet

AM29LV800BT90WBE Spansion

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SPANSION INC SPANSION INC
Part Package Code BGA BGA
Package Description 0.65 MM PITCH, MICRO, BGA-48 BGA,
Pin Count 48 48
Reach Compliance Code compliant compliant
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.51
Access Time-Max 150 ns 90 ns
Additional Feature CONFIGURABLE AS 512K X 16 CONFG AS 512K X 16; 1000K WRITE CYCLES MIN; DATA RETENTION 20 YEARS; TOP BOOT BLOCK
Boot Block BOTTOM
JESD-30 Code R-PBGA-B48 R-PBGA-B48
JESD-609 Code e0 e0
Length 11.25 mm
Memory Density 8388608 bit 8388608 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 1MX8 1MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.65 mm
Terminal Position BOTTOM BOTTOM
Type NOR TYPE
Width 5.6 mm
Base Number Matches 2 2
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 240
Time@Peak Reflow Temperature-Max (s) 30

Compare AM29DL800B-150UAE with alternatives

Compare AM29LV800BT90WBE with alternatives