AM29DL640D90PCF vs S29GL064N90FFI060 feature comparison

AM29DL640D90PCF Spansion

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S29GL064N90FFI060 Spansion

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Rohs Code Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer SPANSION INC SPANSION INC
Part Package Code BGA BGA
Package Description 13 X 11 MM, FBGA-64 13 X 11 MM, LEAD FREE, FBGA-64
Pin Count 64 64
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 90 ns 90 ns
Alternate Memory Width 8
Boot Block BOTTOM/TOP BOTTOM/TOP
JESD-30 Code R-PBGA-B64 R-PBGA-B64
JESD-609 Code e1
Length 13 mm 13 mm
Memory Density 67108864 bit 67108864 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 64 64
Number of Words 4194304 words 4194304 words
Number of Words Code 4000000 4000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 4MX16 4MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.4 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Type NOR TYPE NOR TYPE
Width 11 mm 11 mm
Base Number Matches 1 2

Compare AM29DL640D90PCF with alternatives

Compare S29GL064N90FFI060 with alternatives