AM29DL324DB90WDIN vs AM29DL322DB90WDFN feature comparison

AM29DL324DB90WDIN AMD

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AM29DL322DB90WDFN Spansion

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Rohs Code No Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC SPANSION INC
Part Package Code BGA BGA
Package Description TFBGA, BGA63,8X12,32 TFBGA,
Pin Count 63 63
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 90 ns 90 ns
Additional Feature MINIMUM 1000K PROGRAM/ERASE CYCLE; 20 YEAR DATA RETENTION
Alternate Memory Width 8 8
Boot Block BOTTOM BOTTOM
Command User Interface YES
Common Flash Interface YES
Data Polling YES
Data Retention Time-Min 20
JESD-30 Code R-PBGA-B63 R-PBGA-B63
JESD-609 Code e0 e1
Length 14 mm 14 mm
Memory Density 33554432 bit 33554432 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Sectors/Size 8,63
Number of Terminals 63 63
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 2MX16 2MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Equivalence Code BGA63,8X12,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Ready/Busy YES
Seated Height-Max 1.2 mm 1.2 mm
Sector Size 8K,64K
Standby Current-Max 0.000005 A
Supply Current-Max 0.045 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Toggle Bit YES
Type NOR TYPE NOR TYPE
Width 8 mm 8 mm
Base Number Matches 1 1
Moisture Sensitivity Level 3

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