AM29DL324DB70RWDIN
vs
AM29DL324GB70WDI
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
SPANSION INC
Reach Compliance Code
compliant
not_compliant
Access Time-Max
70 ns
70 ns
Alternate Memory Width
8
8
Boot Block
BOTTOM
BOTTOM
Command User Interface
YES
YES
Common Flash Interface
YES
YES
Data Polling
YES
YES
JESD-30 Code
R-PBGA-B63
R-PBGA-B63
Memory Density
33554432 bit
33554432 bit
Memory IC Type
FLASH
FLASH
Number of Sectors/Size
8,63
8,63
Number of Terminals
63
63
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
2MX16
2MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
FBGA
TFBGA
Package Equivalence Code
BGA63,8X12,32
BGA63,8X12,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Power Supplies
3.3 V
Qualification Status
Not Qualified
Not Qualified
Ready/Busy
YES
YES
Sector Size
8K,64K
8K,64K
Standby Current-Max
0.000005 A
0.000005 A
Supply Current-Max
0.045 mA
0.045 mA
Supply Voltage-Nom (Vsup)
3.3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Toggle Bit
YES
YES
Type
NOR TYPE
NOR TYPE
Base Number Matches
3
2
Pbfree Code
Part Package Code
BGA
Package Description
8 X 14 MM, 0.80 MM PITCH, FBGA-63
Pin Count
63
ECCN Code
EAR99
HTS Code
8542.32.00.51
JESD-609 Code
e0
Length
14 mm
Memory Width
16
Moisture Sensitivity Level
3
Number of Functions
1
Operating Mode
ASYNCHRONOUS
Peak Reflow Temperature (Cel)
260
Programming Voltage
3 V
Seated Height-Max
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
Terminal Finish
TIN LEAD
Width
8 mm
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