AM29DL323GT90WDF
vs
K8C5715ETM-FE1F0
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
SPANSION INC
|
SAMSUNG SEMICONDUCTOR INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
8 X 14 MM, 0.80 MM PITCH, LEAD FREE, FBGA-63
|
10.50 X 14 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FBGA-167
|
| Pin Count |
63
|
167
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Access Time-Max |
90 ns
|
100 ns
|
| Alternate Memory Width |
8
|
|
| Boot Block |
TOP
|
TOP
|
| Command User Interface |
YES
|
YES
|
| Common Flash Interface |
YES
|
YES
|
| Data Polling |
YES
|
YES
|
| JESD-30 Code |
R-PBGA-B63
|
R-PBGA-B167
|
| JESD-609 Code |
e1
|
e0
|
| Length |
14 mm
|
14 mm
|
| Memory Density |
33554432 bit
|
268435456 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
16
|
16
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
1
|
| Number of Sectors/Size |
8,63
|
4,255
|
| Number of Terminals |
63
|
167
|
| Number of Words |
2097152 words
|
16777216 words
|
| Number of Words Code |
2000000
|
16000000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-25 °C
|
| Organization |
2MX16
|
16MX16
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFBGA
|
LFBGA
|
| Package Equivalence Code |
BGA63,8X12,32
|
BGA167,12X15,32
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Programming Voltage |
3 V
|
1.8 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Ready/Busy |
YES
|
YES
|
| Seated Height-Max |
1.2 mm
|
1.4 mm
|
| Sector Size |
8K,64K
|
16K,64K
|
| Standby Current-Max |
0.000005 A
|
0.00002 A
|
| Supply Current-Max |
0.045 mA
|
0.055 mA
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
1.95 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
1.7 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
OTHER
|
| Terminal Finish |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
|
TIN LEAD
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Toggle Bit |
YES
|
YES
|
| Type |
NOR TYPE
|
NOR TYPE
|
| Width |
8 mm
|
10.5 mm
|
| Base Number Matches |
1
|
1
|
| Additional Feature |
|
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
|
|
|
|
Compare AM29DL323GT90WDF with alternatives
Compare K8C5715ETM-FE1F0 with alternatives