We use Cookies to give you best experience on our website. By using our website and services, you expressly agree to the placement of our performance, functionality and advertising cookies. Please see our Privacy Policy for more information.

Register or Sign In

AM29DL322GT90WDI vs K8C5715ETM-DE1F0 feature comparison

AM29DL322GT90WDI Spansion

Buy Now Datasheet

K8C5715ETM-DE1F0 Samsung Semiconductor

Buy Now Datasheet
Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SPANSION INC SAMSUNG SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description 8 X 14 MM, 0.80 MM PITCH, FBGA-63 10.50 X 14 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-167
Pin Count 63 167
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 90 ns 100 ns
Alternate Memory Width 8
Boot Block TOP TOP
Command User Interface YES YES
Common Flash Interface YES YES
Data Polling YES YES
JESD-30 Code R-PBGA-B63 R-PBGA-B167
JESD-609 Code e0 e1
Length 14 mm 14 mm
Memory Density 33554432 bit 268435456 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Moisture Sensitivity Level 3 2
Number of Functions 1 1
Number of Sectors/Size 8,63 4,255
Number of Terminals 63 167
Number of Words 2097152 words 16777216 words
Number of Words Code 2000000 16000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -25 °C
Organization 2MX16 16MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA LFBGA
Package Equivalence Code BGA63,8X12,32 BGA167,12X15,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260
Programming Voltage 3 V 1.8 V
Qualification Status Not Qualified Not Qualified
Ready/Busy YES YES
Seated Height-Max 1.2 mm 1.4 mm
Sector Size 8K,64K 16K,64K
Standby Current-Max 0.000005 A 0.00002 A
Supply Current-Max 0.045 mA 0.055 mA
Supply Voltage-Max (Vsup) 3.6 V 1.95 V
Supply Voltage-Min (Vsup) 2.7 V 1.7 V
Supply Voltage-Nom (Vsup) 3 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL OTHER
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Toggle Bit YES YES
Type NOR TYPE NOR TYPE
Width 8 mm 10.5 mm
Base Number Matches 2 1
Additional Feature SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
Memory » Flash Memories
Memory » Flash Memories

Compare AM29DL322GT90WDI with alternatives

Compare K8C5715ETM-DE1F0 with alternatives