AM29DL322GT70PCF
vs
AM29DL323GT70RPCI
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
SPANSION INC
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
70 ns
70 ns
Alternate Memory Width
8
8
Boot Block
TOP
TOP
Command User Interface
YES
YES
Common Flash Interface
YES
YES
Data Polling
YES
YES
JESD-30 Code
S-PBGA-B64
R-PBGA-B64
Memory Density
33554432 bit
33554432 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Sectors/Size
8,63
8,63
Number of Terminals
64
64
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
2MX16
2MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LBGA
Package Equivalence Code
BGA64,8X8,40
BGA64,8X8,40
Package Shape
SQUARE
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Ready/Busy
YES
YES
Sector Size
8K,64K
8K,64K
Standby Current-Max
0.000005 A
0.000005 A
Supply Current-Max
0.045 mA
0.045 mA
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Toggle Bit
YES
YES
Type
NOR TYPE
NOR TYPE
Base Number Matches
2
2
Part Package Code
BGA
Package Description
11 X 13 MM, 1 MM PITCH, FBGA-64
Pin Count
64
JESD-609 Code
e0
Length
13 mm
Moisture Sensitivity Level
3
Number of Functions
1
Operating Mode
ASYNCHRONOUS
Peak Reflow Temperature (Cel)
260
Programming Voltage
3 V
Seated Height-Max
1.4 mm
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
Supply Voltage-Nom (Vsup)
3 V
Terminal Finish
TIN LEAD
Width
11 mm
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