AM29DL322GB60FIN vs S29JL032J60TFI213 feature comparison

AM29DL322GB60FIN AMD

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S29JL032J60TFI213 Infineon Technologies AG

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Rohs Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC INFINEON TECHNOLOGIES AG
Part Package Code TSOP
Package Description TSOP1-R, TSSOP48,.8,20
Pin Count 48
Reach Compliance Code unknown compliant
ECCN Code EAR99
HTS Code 8542.32.00.51
Access Time-Max 60 ns
Alternate Memory Width 8
Boot Block BOTTOM
Command User Interface YES
Common Flash Interface YES
Data Polling YES
JESD-30 Code R-PDSO-G48
JESD-609 Code e0
Length 18.4 mm
Memory Density 33554432 bit
Memory IC Type FLASH FLASH
Memory Width 16
Number of Functions 1
Number of Sectors/Size 8,63
Number of Terminals 48
Number of Words 2097152 words
Number of Words Code 2000000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 2MX16
Package Body Material PLASTIC/EPOXY
Package Code TSOP1-R
Package Equivalence Code TSSOP48,.8,20
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL
Programming Voltage 3 V
Qualification Status Not Qualified
Ready/Busy YES
Reverse Pinout YES
Seated Height-Max 1.2 mm
Sector Size 8K,64K
Standby Current-Max 0.000005 A
Supply Current-Max 0.045 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form GULL WING
Terminal Pitch 0.5 mm
Terminal Position DUAL
Toggle Bit YES
Type NOR TYPE
Width 12 mm
Base Number Matches 2 3

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