AM29DL162CB-90WCI
vs
AM29LV160BT90WEE
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
SPANSION INC
Part Package Code
BGA
Package Description
TFBGA,
BGA,
Pin Count
48
Reach Compliance Code
unknown
compliant
Access Time-Max
90 ns
90 ns
Additional Feature
USER CONFIGURABLE AS 1M X 16
MIN 1000K WRITE CYCLES; 20 YEAR DATA RETENTION; CAN BE CONFG AS 1M X 16; TOP BOOT BLOCK
JESD-30 Code
R-PBGA-B48
R-PBGA-B48
Length
9 mm
Memory Density
16777216 bit
16777216 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
48
48
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Organization
2MX8
2MX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
BGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
3 V
3 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
8 mm
Base Number Matches
1
2
Rohs Code
No
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.51
Boot Block
TOP
Data Retention Time-Min
20
JESD-609 Code
e0
Moisture Sensitivity Level
3
Terminal Finish
TIN LEAD
Type
NOR TYPE
Compare AM29DL162CB-90WCI with alternatives
Compare AM29LV160BT90WEE with alternatives