AM29C827PC
vs
N74F827N
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
PHILIPS SEMICONDUCTORS
Part Package Code
DIP
Package Description
DIP, DIP24,.3
DIP-24
Pin Count
24
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
WITH DUAL OUTPUT ENABLE
Control Type
ENABLE LOW
ENABLE LOW
Family
CMOS
JESD-30 Code
R-PDIP-T24
R-PDIP-T24
JESD-609 Code
e0
e3
Length
32.004 mm
Load Capacitance (CL)
50 pF
Logic IC Type
BUS DRIVER
BUS DRIVER
Max I(ol)
0.024 A
0.064 A
Number of Bits
10
10
Number of Functions
1
1
Number of Ports
2
Number of Terminals
24
24
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP24,.3
DIP24,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Prop. Delay@Nom-Sup
10 ns
18 ns
Propagation Delay (tpd)
10 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.715 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
TTL
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Matte Tin (Sn)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
Base Number Matches
2
3
Power Supply Current-Max (ICC)
100 mA
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