AM29C823/BKA
vs
AM29C828LC
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
ROCHESTER ELECTRONICS INC
|
| Part Package Code |
DFP
|
QLCC
|
| Package Description |
DFP,
|
QCCN,
|
| Pin Count |
24
|
28
|
| Reach Compliance Code |
unknown
|
unknown
|
| Additional Feature |
WITH CLEAR AND CLOCK ENABLE
|
WITH DUAL OUTPUT ENABLE
|
| Family |
CMOS
|
CMOS
|
| JESD-30 Code |
R-GDFP-F24
|
S-CQCC-N28
|
| JESD-609 Code |
e0
|
e0
|
| Length |
15.367 mm
|
11.43 mm
|
| Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
| Moisture Sensitivity Level |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Number of Bits |
9
|
10
|
| Number of Functions |
1
|
1
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
24
|
28
|
| Operating Temperature-Max |
125 °C
|
70 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
INVERTED
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DFP
|
QCCN
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
FLATPACK
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Propagation Delay (tpd) |
14 ns
|
10 ns
|
| Qualification Status |
COMMERCIAL
|
COMMERCIAL
|
| Seated Height-Max |
2.286 mm
|
2.54 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
FLAT
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Width |
9.525 mm
|
11.43 mm
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare AM29C823/BKA with alternatives
Compare AM29C828LC with alternatives