AM29C821APC vs AM29C828APCB feature comparison

AM29C821APC Rochester Electronics LLC

Buy Now Datasheet

AM29C828APCB AMD

Buy Now Datasheet
Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC ADVANCED MICRO DEVICES INC
Part Package Code DIP DIP
Package Description DIP, DIP, DIP24,.3
Pin Count 24 24
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family CMOS CMOS
JESD-30 Code R-PDIP-T24 R-PDIP-T24
Length 30.734 mm 31.242 mm
Logic IC Type BUS DRIVER BUS DRIVER
Number of Bits 10 10
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 24 24
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Propagation Delay (tpd) 15.5 ns 6.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 5.715 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm 7.62 mm
Base Number Matches 2 1
Additional Feature WITH DUAL OUTPUT ENABLE
Control Type ENABLE LOW
JESD-609 Code e0
Load Capacitance (CL) 50 pF
Max I(ol) 0.048 A
Package Equivalence Code DIP24,.3
Prop. Delay@Nom-Sup 7.5 ns
Terminal Finish TIN LEAD

Compare AM29C821APC with alternatives

Compare AM29C828APCB with alternatives