AM29C818ASC
vs
AM29C818DE
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
ADVANCED MICRO DEVICES INC
|
| Part Package Code |
SOIC
|
DIP
|
| Package Description |
SOP,
|
DIP,
|
| Pin Count |
24
|
24
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Additional Feature |
DIAGNOSTIC SCAN REGISTER WITH SELECTABLE SERIAL & PARALLEL DATA I/P'S
|
DIAGNOSTIC SCAN REGISTER WITH SELECTABLE SERIAL & PARALLEL DATA I/P'S
|
| Family |
CMOS
|
CMOS
|
| JESD-30 Code |
R-PDSO-G24
|
R-GDIP-T24
|
| JESD-609 Code |
e0
|
e0
|
| Length |
15.4 mm
|
31.9405 mm
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
SOP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Propagation Delay (tpd) |
12 ns
|
14 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3 mm
|
5.08 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.5 mm
|
7.62 mm
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare AM29C818ASC with alternatives
Compare AM29C818DE with alternatives