AM29C660AGC
vs
IDT49C466APQF
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
PGA
|
QFP
|
| Package Description |
PGA, PGA68,11X11
|
PLASTIC, QFP-208
|
| Pin Count |
68
|
208
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
BUILT IN DIAGNOSTICS; BYTE CONTROL
|
FEED THROUGH EDAC; CONFIGURABLE 16 DEEP BUS READ/WRITE FIFOS FLAGS; BYTE CONTROL
|
| Family |
CMOS
|
49C
|
| JESD-30 Code |
S-CPGA-P68
|
S-PQFP-G208
|
| JESD-609 Code |
e0
|
e0
|
| Length |
29.464 mm
|
28 mm
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
ERROR DETECTION AND CORRECTION CIRCUIT
|
ERROR DETECTION AND CORRECTION CIRCUIT
|
| Number of Bits |
32
|
64
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
68
|
208
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
| Package Code |
PGA
|
FQFP
|
| Package Equivalence Code |
PGA68,11X11
|
QFP208,1.2SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
FLATPACK, FINE PITCH
|
| Propagation Delay (tpd) |
36 ns
|
15 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.953 mm
|
4.07 mm
|
| Supply Voltage-Max (Vsup) |
5.25 V
|
5.25 V
|
| Supply Voltage-Min (Vsup) |
4.75 V
|
4.75 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
PIN/PEG
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
0.5 mm
|
| Terminal Position |
PERPENDICULAR
|
QUAD
|
| Width |
29.464 mm
|
28 mm
|
| Base Number Matches |
2
|
3
|
|
|
|
Compare AM29C660AGC with alternatives
Compare IDT49C466APQF with alternatives