AM29C60PC
vs
AM2960A/BXC
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
ADVANCED MICRO DEVICES INC
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
DIP, DIP48,.6
|
DIP, DIP48,.6
|
| Pin Count |
48
|
48
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
BUILT IN DIAGNOSTICS; BYTE CONTROL
|
BUILT IN DIAGNOSTICS; BYTE CONTROL
|
| Family |
CMOS
|
S
|
| JESD-30 Code |
R-PDIP-T48
|
R-CDIP-T48
|
| JESD-609 Code |
e0
|
e0
|
| Length |
61.849 mm
|
60.96 mm
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
ERROR DETECTION AND CORRECTION CIRCUIT
|
ERROR DETECTION AND CORRECTION CIRCUIT
|
| Number of Bits |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
48
|
48
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP48,.6
|
DIP48,.6
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Propagation Delay (tpd) |
65 ns
|
30 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.715 mm
|
4.445 mm
|
| Supply Voltage-Max (Vsup) |
5.25 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.75 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
BIPOLAR
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
15.24 mm
|
15.24 mm
|
| Base Number Matches |
2
|
1
|
| Power Supply Current-Max (ICC) |
|
400 mA
|
| Screening Level |
|
38535Q/M;38534H;883B
|
|
|
|
Compare AM29C60PC with alternatives
Compare AM2960A/BXC with alternatives