AM29C01-1DC vs MAS2901CC feature comparison

AM29C01-1DC Rochester Electronics LLC

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MAS2901CC Dynex Semiconductor

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC GEC PLESSEY SEMICONDUCTORS
Package Description DIP, ,
Reach Compliance Code unknown unknown
ECCN Code 3A991.A.2 3A001.A.2.C
HTS Code 8542.31.00.01 8542.31.00.01
Clock Frequency-Max 33.3 MHz 25 MHz
External Data Bus Width 4 4
JESD-30 Code R-GDIP-T40 R-CDIP-T40
Length 52.324 mm
Number of Terminals 40 40
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 5.715 mm
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 15.24 mm
uPs/uCs/Peripheral ICs Type BIT-SLICE MICROPROCESSOR BIT-SLICE MICROPROCESSOR
Base Number Matches 2 1
Qualification Status Not Qualified
Supply Current-Max 10 mA

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