AM29BL162CB-80RDWK1 vs AM29BL162CB-80RDPE1 feature comparison

AM29BL162CB-80RDWK1 Spansion

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AM29BL162CB-80RDPE1 Spansion

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SPANSION INC SPANSION INC
Part Package Code WAFER DIE
Package Description WAFER-52 DIE, DIE OR CHIP
Pin Count 52 52
Reach Compliance Code compliant compliant
ECCN Code 3A001.A.2.C EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 80 ns 80 ns
Additional Feature BOTTOM BOOT BLOCK BOTTOM BOOT BLOCK
Boot Block BOTTOM BOTTOM
JESD-30 Code R-XUUC-N52 R-XUUC-N52
JESD-609 Code e3 e0
Memory Density 16777216 bit 16777216 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 52 52
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 1MX16 1MX16
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code DIE DIE
Package Shape RECTANGULAR RECTANGULAR
Package Style UNCASED CHIP UNCASED CHIP
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN TIN LEAD
Terminal Form NO LEAD NO LEAD
Terminal Position UPPER UPPER
Type NOR TYPE NOR TYPE
Base Number Matches 1 1
Command User Interface YES
Data Polling YES
Number of Sectors/Size 1,2,1,7
Package Equivalence Code DIE OR CHIP
Ready/Busy YES
Sector Size 8K,4K,112K,128K
Standby Current-Max 0.000035 A
Toggle Bit YES

Compare AM29BL162CB-80RDWK1 with alternatives

Compare AM29BL162CB-80RDPE1 with alternatives