AM29BDD160GB54DKK
vs
S29CD016G0PQAN013
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
ADVANCED MICRO DEVICES INC
|
| Part Package Code |
QFP
|
|
| Package Description |
LEAD FREE, PLASTIC, QFP-80
|
,
|
| Pin Count |
80
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Access Time-Max |
54 ns
|
|
| Additional Feature |
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
|
|
| Alternate Memory Width |
16
|
|
| Boot Block |
BOTTOM
|
BOTTOM
|
| Command User Interface |
YES
|
|
| Common Flash Interface |
YES
|
|
| Data Polling |
YES
|
|
| JESD-30 Code |
R-PQFP-G80
|
|
| Length |
20 mm
|
|
| Memory Density |
16777216 bit
|
|
| Memory IC Type |
FLASH
|
|
| Memory Width |
32
|
|
| Number of Functions |
1
|
|
| Number of Sectors/Size |
16,30
|
|
| Number of Terminals |
80
|
|
| Number of Words |
524288 words
|
|
| Number of Words Code |
512000
|
|
| Operating Mode |
ASYNCHRONOUS
|
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
512KX32
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
QFP
|
|
| Package Equivalence Code |
QFP80,.7X.9,32
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
FLATPACK
|
|
| Parallel/Serial |
PARALLEL
|
|
| Programming Voltage |
2.7 V
|
|
| Qualification Status |
Not Qualified
|
|
| Ready/Busy |
YES
|
|
| Seated Height-Max |
3.35 mm
|
|
| Sector Size |
8K,64K
|
|
| Standby Current-Max |
0.00006 A
|
|
| Supply Current-Max |
0.09 mA
|
|
| Supply Voltage-Max (Vsup) |
2.75 V
|
|
| Supply Voltage-Min (Vsup) |
2.5 V
|
|
| Supply Voltage-Nom (Vsup) |
2.6 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
AUTOMOTIVE
|
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
0.8 mm
|
|
| Terminal Position |
QUAD
|
|
| Toggle Bit |
YES
|
|
| Type |
NOR TYPE
|
|
| Width |
14 mm
|
|
| Base Number Matches |
3
|
2
|
|
|
|
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