AM29862LCB
vs
N74F862N
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
PHILIPS SEMICONDUCTORS
|
| Part Package Code |
QLCC
|
|
| Package Description |
QCCN, LCC28,.45SQ
|
DIP, DIP24,.3
|
| Pin Count |
28
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION
|
|
| Control Type |
INDEPENDENT CONTROL
|
INDEPENDENT CONTROL
|
| Count Direction |
BIDIRECTIONAL
|
BIDIRECTIONAL
|
| Family |
S
|
|
| JESD-30 Code |
S-CQCC-N28
|
R-PDIP-T24
|
| JESD-609 Code |
e0
|
e3
|
| Length |
8.89 mm
|
|
| Load Capacitance (CL) |
300 pF
|
|
| Logic IC Type |
BUS TRANSCEIVER
|
|
| Max I(ol) |
0.048 A
|
0.064 A
|
| Number of Bits |
10
|
10
|
| Number of Functions |
1
|
1
|
| Number of Ports |
2
|
|
| Number of Terminals |
28
|
24
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
INVERTED
|
INVERTED
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
| Package Code |
QCCN
|
DIP
|
| Package Equivalence Code |
LCC28,.45SQ
|
DIP24,.3
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
IN-LINE
|
| Power Supply Current-Max (ICC) |
160 mA
|
170 mA
|
| Prop. Delay@Nom-Sup |
25 ns
|
10.5 ns
|
| Propagation Delay (tpd) |
14 ns
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.54 mm
|
|
| Supply Voltage-Max (Vsup) |
5.25 V
|
|
| Supply Voltage-Min (Vsup) |
4.75 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
YES
|
NO
|
| Technology |
TTL
|
TTL
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
Matte Tin (Sn)
|
| Terminal Form |
NO LEAD
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Width |
8.89 mm
|
|
| Base Number Matches |
1
|
3
|
|
|
|
Compare AM29862LCB with alternatives