AM29841DCB vs AM29841XC feature comparison

AM29841DCB Rochester Electronics LLC

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AM29841XC AMD

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS INC ADVANCED MICRO DEVICES INC
Part Package Code DIP DIE
Package Description DIP, DIE,
Pin Count 24 24
Reach Compliance Code unknown unknown
Family S S
JESD-30 Code R-CDIP-T24 R-XUUC-N24
JESD-609 Code e0
Length 32.0675 mm
Logic IC Type BUS DRIVER BUS DRIVER
Moisture Sensitivity Level NOT SPECIFIED
Number of Bits 10 10
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 24 24
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material CERAMIC, METAL-SEALED COFIRED UNSPECIFIED
Package Code DIP DIE
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE UNCASED CHIP
Peak Reflow Temperature (Cel) NOT SPECIFIED
Propagation Delay (tpd) 12 ns 12 ns
Qualification Status COMMERCIAL Not Qualified
Seated Height-Max 5.715 mm
Supply Voltage-Max (Vsup) 5.25 V 5.25 V
Supply Voltage-Min (Vsup) 4.75 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology TTL TTL
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm
Terminal Position DUAL UPPER
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm
Base Number Matches 2 2
HTS Code 8542.39.00.01
Load Capacitance (CL) 50 pF
Package Equivalence Code DIE OR CHIP
Power Supply Current-Max (ICC) 120 mA

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