AM29823APCB
vs
5962-9161101M3X
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
QP SEMICONDUCTOR INC
|
| Part Package Code |
DIP
|
QLCC
|
| Package Description |
DIP,
|
QCCN,
|
| Pin Count |
24
|
28
|
| Reach Compliance Code |
unknown
|
unknown
|
| Additional Feature |
WITH CLEAR AND CLOCK ENABLE
|
WITH TRIPLE OUTPUT ENABLE; WITH CLEAR AND CLOCK ENABLE
|
| Family |
S
|
ACT
|
| JESD-30 Code |
R-PDIP-T24
|
S-CQCC-N28
|
| JESD-609 Code |
e0
|
|
| Length |
32.004 mm
|
11.43 mm
|
| Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
| Moisture Sensitivity Level |
NOT SPECIFIED
|
|
| Number of Bits |
9
|
8
|
| Number of Functions |
1
|
1
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
24
|
28
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
QCCN
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
IN-LINE
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Propagation Delay (tpd) |
10 ns
|
11.5 ns
|
| Qualification Status |
COMMERCIAL
|
Not Qualified
|
| Seated Height-Max |
5.715 mm
|
1.905 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
TTL
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
7.62 mm
|
11.43 mm
|
| Base Number Matches |
1
|
1
|
| HTS Code |
|
8542.39.00.01
|
| Screening Level |
|
MIL-STD-883
|
|
|
|
Compare AM29823APCB with alternatives
Compare 5962-9161101M3X with alternatives