AM2964CDMB
vs
74F764N
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
SIGNETICS CORP
Part Package Code
DIP
Package Description
DIP,
,
Pin Count
40
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
16
18
Boundary Scan
NO
NO
External Data Bus Width
JESD-30 Code
R-CDIP-T40
R-PDIP-T48
Length
52.324 mm
Low Power Mode
NO
NO
Memory Organization
176K X 8
256K X 1
Number of Banks
4
1
Number of Terminals
40
48
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.715 mm
Supply Current-Max
164 mA
210 mA
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
BIPOLAR
BIPOLAR
Temperature Grade
MILITARY
COMMERCIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
uPs/uCs/Peripheral ICs Type
MEMORY CONTROLLER, DRAM
MEMORY CONTROLLER, DRAM
Base Number Matches
1
4
Bus Compatibility
68020; 68000; 8086; Z-80
Compare AM2964CDMB with alternatives
Compare 74F764N with alternatives