AM2956LC
vs
AM2956DMB
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
ADVANCED MICRO DEVICES INC
|
| Part Package Code |
QLCC
|
DIP
|
| Package Description |
QCCN, LCC20,.35SQ
|
DIP, DIP20,.3
|
| Pin Count |
20
|
20
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
S
|
S
|
| JESD-30 Code |
S-CQCC-N20
|
R-CDIP-T20
|
| JESD-609 Code |
e0
|
e0
|
| Length |
8.89 mm
|
24.4602 mm
|
| Load Capacitance (CL) |
15 pF
|
15 pF
|
| Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
QCCN
|
DIP
|
| Package Equivalence Code |
LCC20,.35SQ
|
DIP20,.3
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
IN-LINE
|
| Power Supply Current-Max (ICC) |
160 mA
|
160 mA
|
| Propagation Delay (tpd) |
18 ns
|
18 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.54 mm
|
5.08 mm
|
| Supply Voltage-Max (Vsup) |
5.25 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.75 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
TTL
|
TTL
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
NO LEAD
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Width |
8.89 mm
|
7.62 mm
|
| Base Number Matches |
1
|
1
|
| Screening Level |
|
MIL-STD-883 Class B (Modified)
|
|
|
|
Compare AM2956LC with alternatives
Compare AM2956DMB with alternatives