AM29332GC
vs
AM29C332/BZC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
ROCHESTER ELECTRONICS LLC
Part Package Code
PGA
PGA
Package Description
CERAMIC, HEAT SINK, PGA-169
PGA,
Pin Count
169
169
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
External Data Bus Width
32
32
JESD-30 Code
S-CPGA-P169
S-CPGA-P169
JESD-609 Code
e0
e0
Length
44.704 mm
44.704 mm
Number of Terminals
169
169
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
HPGA
PGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, HEAT SINK/SLUG
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
10.668 mm
4.953 mm
Supply Current-Max
1800 mA
Supply Voltage-Max
5.25 V
5.5 V
Supply Voltage-Min
4.75 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
CMOS
Temperature Grade
OTHER
MILITARY
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
PIN/PEG
PIN/PEG
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
PERPENDICULAR
PERPENDICULAR
Width
44.704 mm
44.704 mm
uPs/uCs/Peripheral ICs Type
BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER
BIT-SLICE MICROPROCESSOR
Base Number Matches
1
2
Pbfree Code
ECCN Code
3A001.A.2.C
Compare AM29332GC with alternatives
Compare AM29C332/BZC with alternatives