AM2917ADMB
vs
AM2949XC
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
ADVANCED MICRO DEVICES INC
|
Part Package Code |
DIP
|
DIE
|
Package Description |
DIP, DIP20,.3
|
DIE,
|
Pin Count |
20
|
20
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
BUS O/PS & RECEIVER O/PS ARE AVAILABLE; SELECTABLE MULTIPLEXER INPUTS
|
|
Control Type |
INDEPENDENT CONTROL
|
|
Count Direction |
UNIDIRECTIONAL
|
|
Family |
TTL/H/L
|
TTL/H/L
|
JESD-30 Code |
R-CDIP-T20
|
R-XUUC-N20
|
JESD-609 Code |
e0
|
|
Length |
24.4602 mm
|
|
Load Capacitance (CL) |
50 pF
|
300 pF
|
Logic IC Type |
REGISTERED BUS TRANSCEIVER
|
BUS TRANSCEIVER
|
Number of Bits |
4
|
8
|
Number of Functions |
1
|
1
|
Number of Ports |
2
|
2
|
Number of Terminals |
20
|
20
|
Operating Temperature-Max |
125 °C
|
70 °C
|
Operating Temperature-Min |
-55 °C
|
|
Output Characteristics |
3-STATE
|
3-STATE
|
Output Polarity |
INVERTED
|
TRUE
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
UNSPECIFIED
|
Package Code |
DIP
|
DIE
|
Package Equivalence Code |
DIP20,.3
|
DIE OR CHIP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
UNCASED CHIP
|
Power Supply Current-Max (ICC) |
95 mA
|
140 mA
|
Propagation Delay (tpd) |
36 ns
|
34 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
MIL-STD-883 Class B (Modified)
|
|
Seated Height-Max |
5.08 mm
|
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.25 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.75 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
YES
|
Technology |
TTL
|
TTL
|
Temperature Grade |
MILITARY
|
COMMERCIAL
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
Terminal Pitch |
2.54 mm
|
|
Terminal Position |
DUAL
|
UPPER
|
Width |
7.62 mm
|
|
Base Number Matches |
2
|
1
|
|
|
|
Compare AM2917ADMB with alternatives
Compare AM2949XC with alternatives