AM2913XC vs 9324DMQB feature comparison

AM2913XC AMD

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9324DMQB National Semiconductor Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC NATIONAL SEMICONDUCTOR CORP
Part Package Code DIE
Package Description DIE, DIP, DIP16,.3
Pin Count 20
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LS 93
JESD-30 Code R-XUUC-N20 R-GDIP-T16
Logic IC Type ENCODER MAGNITUDE COMPARATOR
Number of Bits 8 5
Number of Functions 1 1
Number of Terminals 20 16
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Output Characteristics 3-STATE
Package Body Material UNSPECIFIED CERAMIC, GLASS-SEALED
Package Code DIE DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style UNCASED CHIP IN-LINE
Propagation Delay (tpd) 30 ns 32 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.25 V 5.5 V
Supply Voltage-Min (Vsup) 4.75 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology TTL TTL
Temperature Grade COMMERCIAL MILITARY
Terminal Form NO LEAD THROUGH-HOLE
Terminal Position UPPER DUAL
Base Number Matches 1 4
Rohs Code No
Additional Feature WITH INHIBIT
JESD-609 Code e0
Length 19.43 mm
Load Capacitance (CL) 15 pF
Output Polarity TRUE
Package Equivalence Code DIP16,.3
Power Supply Current-Max (ICC) 81 mA
Screening Level 38535Q/M;38534H;883B
Seated Height-Max 5.08 mm
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm
Width 7.62 mm

Compare AM2913XC with alternatives

Compare 9324DMQB with alternatives