AM2910ADMB vs AM2910ADCB feature comparison

AM2910ADMB Rochester Electronics LLC

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AM2910ADCB AMD

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC ADVANCED MICRO DEVICES INC
Package Description DIP, DIP, DIP40,.6
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.31.00.01 8542.31.00.01
Clock Frequency-Max 19.6 MHz 20 MHz
External Data Bus Width 12 12
JESD-30 Code R-GDIP-T40 R-GDIP-T40
Length 52.07 mm 52.07 mm
Number of Terminals 40 40
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 5.715 mm 5.715 mm
Supply Voltage-Max 5.5 V 5.25 V
Supply Voltage-Min 4.5 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade MILITARY COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 15.24 mm 15.24 mm
uPs/uCs/Peripheral ICs Type BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER
Base Number Matches 2 1
Rohs Code No
Part Package Code DIP
Pin Count 40
JESD-609 Code e0
Package Equivalence Code DIP40,.6
Qualification Status Not Qualified
Supply Current-Max 344 mA
Terminal Finish TIN LEAD

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