AM2909ADC vs MAR2911CE feature comparison

AM2909ADC AMD

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MAR2911CE Dynex Semiconductor

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC GEC PLESSEY SEMICONDUCTORS
Part Package Code DIP
Package Description DIP, DIP28,.6 ,
Pin Count 28
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
External Data Bus Width 4 4
JESD-30 Code R-GDIP-T28 R-CDIP-T28
JESD-609 Code e0
Length 37.211 mm
Number of Terminals 28 28
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
Package Code DIP
Package Equivalence Code DIP28,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.715 mm
Supply Current-Max 130 mA 5 mA
Supply Voltage-Max 5.25 V 5.5 V
Supply Voltage-Min 4.75 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology TTL CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm
uPs/uCs/Peripheral ICs Type BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER
Base Number Matches 4 1
ECCN Code 3A001.A.2.C

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