AM2909ADC vs CY2909ADMB feature comparison

AM2909ADC AMD

Buy Now Datasheet

CY2909ADMB Cypress Semiconductor

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC CYPRESS SEMICONDUCTOR CORP
Part Package Code DIP DIP
Package Description DIP, DIP28,.6 0.600 INCH, CERDIP-28
Pin Count 28 28
Reach Compliance Code unknown compliant
HTS Code 8542.31.00.01 8542.31.00.01
External Data Bus Width 4 4
JESD-30 Code R-GDIP-T28 R-GDIP-T28
JESD-609 Code e0 e0
Length 37.211 mm 37.338 mm
Number of Terminals 28 28
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP28,.6 DIP28,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.715 mm 5.715 mm
Supply Current-Max 130 mA 90 mA
Supply Voltage-Max 5.25 V 5.5 V
Supply Voltage-Min 4.75 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology TTL CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
uPs/uCs/Peripheral ICs Type BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER
Base Number Matches 4 1
ECCN Code 3A001.A.2.C
Screening Level 38535Q/M;38534H;883B

Compare AM2909ADC with alternatives

Compare CY2909ADMB with alternatives