AM2903ADC vs AM2903ALMB feature comparison

AM2903ADC Rochester Electronics LLC

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AM2903ALMB AMD

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC ADVANCED MICRO DEVICES INC
Package Description DIP, QCCN, LCC52,.75SQ
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Clock Frequency-Max 10.1 MHz
External Data Bus Width 4 4
JESD-30 Code R-CDIP-T48 S-CQCC-N52
Length 60.96 mm 19.05 mm
Number of Terminals 48 52
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code DIP QCCN
Package Shape RECTANGULAR SQUARE
Package Style IN-LINE CHIP CARRIER
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 5.08 mm 3.048 mm
Supply Voltage-Max 5.25 V 5.5 V
Supply Voltage-Min 4.75 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO YES
Technology TTL TTL
Temperature Grade COMMERCIAL MILITARY
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 15.24 mm 19.05 mm
uPs/uCs/Peripheral ICs Type BIT-SLICE MICROPROCESSOR BIT-SLICE MICROPROCESSOR
Base Number Matches 1 1
Rohs Code No
Part Package Code LCC
Pin Count 52
ECCN Code 3A001.A.2.C
JESD-609 Code e0
Package Equivalence Code LCC52,.75SQ
Qualification Status Not Qualified
Screening Level MIL-STD-883 Class B (Modified)
Supply Current-Max 395 mA
Terminal Finish TIN LEAD

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