AM28F512-75PCB vs SST29VF512-55-4C-WH feature comparison

AM28F512-75PCB AMD

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SST29VF512-55-4C-WH Silicon Storage Technology

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC SILICON STORAGE TECHNOLOGY INC
Part Package Code DIP TSOP1
Package Description PLASTIC, DIP-32 TSOP1,
Pin Count 32 32
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 70 ns 55 ns
Additional Feature BULK ERASE
Command User Interface YES
Data Polling NO
Endurance 10000 Write/Erase Cycles
JESD-30 Code R-PDIP-T32 R-PDSO-G32
JESD-609 Code e0
Length 42.164 mm 12.4 mm
Memory Density 524288 bit 524288 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 64KX8 64KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP TSOP1
Package Equivalence Code DIP32,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 12 V 2.7 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.715 mm 1.2 mm
Standby Current-Max 0.0001 A
Supply Current-Max 0.03 mA
Supply Voltage-Max (Vsup) 5.25 V 3.6 V
Supply Voltage-Min (Vsup) 4.75 V 2.7 V
Supply Voltage-Nom (Vsup) 5 V 3 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.5 mm
Terminal Position DUAL DUAL
Toggle Bit NO
Type NOR TYPE
Width 15.24 mm 8 mm
Base Number Matches 1 1

Compare AM28F512-75PCB with alternatives

Compare SST29VF512-55-4C-WH with alternatives