AM27X256-200JC
vs
CY27C256A-200JI
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
SPANSION INC
|
CYPRESS SEMICONDUCTOR CORP
|
| Part Package Code |
QFJ
|
QFJ
|
| Package Description |
QCCJ,
|
QCCJ,
|
| Pin Count |
32
|
32
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.71
|
8542.32.00.71
|
| Access Time-Max |
200 ns
|
200 ns
|
| JESD-30 Code |
R-PQCC-J32
|
R-PQCC-J32
|
| Length |
13.97 mm
|
|
| Memory Density |
1536 bit
|
262144 bit
|
| Memory IC Type |
OTP ROM
|
OTP ROM
|
| Memory Width |
1
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
32
|
32
|
| Number of Words |
32768 words
|
32768 words
|
| Number of Words Code |
1500
|
32000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
1.5KX1
|
32KX8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
QCCJ
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Parallel/Serial |
SERIAL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.556 mm
|
|
| Supply Current-Max |
0.00002 mA
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2.65 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Form |
J BEND
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
11.43 mm
|
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
No
|
| Rohs Code |
|
No
|
| JESD-609 Code |
|
e0
|
| Output Characteristics |
|
3-STATE
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare AM27X256-200JC with alternatives
Compare CY27C256A-200JI with alternatives