AM27X256-150PI vs CY27C256-150PC feature comparison

AM27X256-150PI Spansion

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CY27C256-150PC Rochester Electronics LLC

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Part Life Cycle Code Obsolete Contact Manufacturer
Ihs Manufacturer SPANSION INC ROCHESTER ELECTRONICS LLC
Part Package Code DIP DIP
Package Description DIP, DIP,
Pin Count 28 28
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 70 ns 150 ns
JESD-30 Code R-PDIP-T28 R-PDIP-T28
Length 37.084 mm
Memory Density 65536 bit 262144 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 32768 words 32768 words
Number of Words Code 8000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 8KX8 32KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.715 mm
Supply Current-Max 0.025 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm
Base Number Matches 3 2
Pbfree Code No
Rohs Code No
JESD-609 Code e0
Terminal Finish TIN LEAD

Compare AM27X256-150PI with alternatives

Compare CY27C256-150PC with alternatives