AM27X1024-150PIXXXXX vs M27V102-200B6 feature comparison

AM27X1024-150PIXXXXX AMD

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M27V102-200B6 STMicroelectronics

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC STMICROELECTRONICS
Part Package Code DIP DIP
Package Description DIP, DIP, DIP40,.6
Pin Count 40 40
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 70 ns 200 ns
JESD-30 Code R-PDIP-T40 R-PDIP-T40
Memory Density 4194304 bit 1048576 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 16
Number of Functions 1 1
Number of Terminals 40 40
Number of Words 65536 words 65536 words
Number of Words Code 512000 64000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 512KX8 64KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Supply Current-Max 0.05 mA 0.015 mA
Supply Voltage-Max (Vsup) 5.5 V 3.63 V
Supply Voltage-Min (Vsup) 4.5 V 2.97 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Number Matches 1 1
I/O Type COMMON
JESD-609 Code e0
Length 52.18 mm
Output Characteristics 3-STATE
Package Equivalence Code DIP40,.6
Standby Current-Max 0.00002 A
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm
Width 15.24 mm

Compare AM27X1024-150PIXXXXX with alternatives

Compare M27V102-200B6 with alternatives