AM27S55ADCB
vs
8200801JA
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
LANSDALE SEMICONDUCTOR INC
|
Part Package Code |
DIP
|
|
Package Description |
DIP, DIP24,.3
|
DIP, DIP24,.6
|
Pin Count |
24
|
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.71
|
8542.32.00.71
|
Access Time-Max |
10 ns
|
95 ns
|
JESD-30 Code |
R-GDIP-T24
|
R-GDIP-T24
|
JESD-609 Code |
e0
|
|
Length |
31.9405 mm
|
|
Memory Density |
32768 bit
|
32768 bit
|
Memory IC Type |
OTP ROM
|
OTP ROM
|
Memory Width |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
24
|
24
|
Number of Words |
4096 words
|
4096 words
|
Number of Words Code |
4000
|
4000
|
Operating Mode |
SYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
75 °C
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Organization |
4KX8
|
4KX8
|
Output Characteristics |
3-STATE
|
|
Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, GLASS-SEALED
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP24,.3
|
DIP24,.6
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Qualified
|
Seated Height-Max |
5.08 mm
|
|
Supply Current-Max |
0.185 mA
|
0.19 mA
|
Supply Voltage-Max (Vsup) |
5.25 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.75 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
BIPOLAR
|
BIPOLAR
|
Temperature Grade |
COMMERCIAL EXTENDED
|
MILITARY
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
7.62 mm
|
|
Base Number Matches |
1
|
6
|
Screening Level |
|
38535Q/M;38534H;883B
|
|
|
|
Compare AM27S55ADCB with alternatives
Compare 8200801JA with alternatives