AM27S49SAPCB
vs
5962-9080308MJA
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
TELEDYNE E2V (UK) LTD
|
Part Package Code |
DIP
|
|
Package Description |
DIP, DIP24,.6
|
DIP, DIP24,.6
|
Pin Count |
24
|
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.71
|
8542.32.00.71
|
Access Time-Max |
35 ns
|
25 ns
|
JESD-30 Code |
R-PDIP-T24
|
R-GDIP-T24
|
JESD-609 Code |
e0
|
e0
|
Length |
32.004 mm
|
31.877 mm
|
Memory Density |
8192 bit
|
65536 bit
|
Memory IC Type |
OTP ROM
|
OTP ROM
|
Memory Width |
4
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
24
|
24
|
Number of Words |
8192 words
|
8192 words
|
Number of Words Code |
2000
|
8000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
75 °C
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Organization |
2KX4
|
8KX8
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP24,.6
|
DIP24,.6
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Qualified
|
Seated Height-Max |
5.715 mm
|
5.715 mm
|
Supply Current-Max |
0.19 mA
|
0.14 mA
|
Supply Voltage-Max (Vsup) |
5.25 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.75 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
BIPOLAR
|
CMOS
|
Temperature Grade |
COMMERCIAL EXTENDED
|
MILITARY
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
15.24 mm
|
15.24 mm
|
Base Number Matches |
1
|
3
|
I/O Type |
|
COMMON
|
Screening Level |
|
38535Q/M;38534H;883B
|
Standby Current-Max |
|
0.05 A
|
|
|
|
Compare AM27S49SAPCB with alternatives
Compare 5962-9080308MJA with alternatives