AM27S35ADCB vs 63RS881AJSXXXX feature comparison

AM27S35ADCB AMD

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63RS881AJSXXXX

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Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC
Part Package Code DIP
Package Description DIP, DIP24,.3
Pin Count 24
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 25 ns
JESD-30 Code R-GDIP-T24
JESD-609 Code e0
Length 31.9405 mm
Memory Density 16384 bit
Memory IC Type OTP ROM
Memory Width 4
Number of Functions 1
Number of Terminals 24
Number of Words 1024 words
Number of Words Code 4000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 75 °C
Operating Temperature-Min
Organization 4KX4
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED
Package Code DIP
Package Equivalence Code DIP24,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 5.08 mm
Supply Current-Max 0.185 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology BIPOLAR
Temperature Grade COMMERCIAL EXTENDED
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 7.62 mm
Base Number Matches 1

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