AM27S35/BUA
vs
AM27S37A/BUA
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
ADVANCED MICRO DEVICES INC
Part Package Code
QFJ
QFJ
Package Description
QCCN, LCC32,.45X.55
QCCN, LCC32,.45X.55
Pin Count
32
32
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Factory Lead Time
4 Weeks
4 Weeks
Access Time-Max
35 ns
30 ns
JESD-30 Code
R-CQCC-N32
R-CQCC-N32
JESD-609 Code
e0
e0
Length
13.97 mm
13.97 mm
Memory Density
2048 bit
16384 bit
Memory IC Type
OTP ROM
OTP ROM
Memory Width
4
4
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
1024 words
1024 words
Number of Words Code
512
4000
Operating Mode
ASYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
512X4
4KX4
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
QCCN
QCCN
Package Equivalence Code
LCC32,.45X.55
LCC32,.45X.55
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
38535Q/M;38534H;883B
38535Q/M;38534H;883B
Seated Height-Max
2.54 mm
2.54 mm
Supply Current-Max
0.185 mA
0.185 mA
Supply Voltage-Max (Vsup)
5.5 V
5.25 V
Supply Voltage-Min (Vsup)
4.5 V
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
BIPOLAR
BIPOLAR
Temperature Grade
MILITARY
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Lead (Sn/Pb)
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Width
11.43 mm
11.43 mm
Base Number Matches
1
1
Compare AM27S35/BUA with alternatives
Compare AM27S37A/BUA with alternatives