AM27S35/BUA vs AM27S180LC feature comparison

AM27S35/BUA AMD

Buy Now Datasheet

AM27S180LC AMD

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC ADVANCED MICRO DEVICES INC
Part Package Code QFJ QFJ
Package Description QCCN, LCC32,.45X.55 QCCN, LCC32,.45X.55
Pin Count 32 32
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Factory Lead Time 4 Weeks
Access Time-Max 35 ns 20 ns
JESD-30 Code R-CQCC-N32 R-CQCC-N32
JESD-609 Code e0 e0
Length 13.97 mm 13.97 mm
Memory Density 2048 bit 524288 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 4 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 1024 words 1024 words
Number of Words Code 512 64000
Operating Mode ASYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 125 °C 75 °C
Operating Temperature-Min -55 °C
Organization 512X4 64KX8
Output Characteristics 3-STATE OPEN-COLLECTOR
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code QCCN QCCN
Package Equivalence Code LCC32,.45X.55 LCC32,.45X.55
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level 38535Q/M;38534H;883B
Seated Height-Max 2.54 mm 2.54 mm
Supply Current-Max 0.185 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology BIPOLAR BIPOLAR
Temperature Grade MILITARY COMMERCIAL EXTENDED
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form NO LEAD NO LEAD
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Width 11.43 mm 11.43 mm
Base Number Matches 1 4
Pbfree Code No

Compare AM27S35/BUA with alternatives

Compare AM27S180LC with alternatives