AM27S35/BLA vs 63RS881AJSXXXX feature comparison

AM27S35/BLA AMD

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63RS881AJSXXXX

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Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC
Part Package Code DIP
Package Description DIP, DIP24,.3
Pin Count 24
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.71
Factory Lead Time 4 Weeks
Access Time-Max 60 ns
JESD-30 Code R-GDIP-T24
JESD-609 Code e0
Length 31.9405 mm
Memory Density 1024 bit
Memory IC Type OTP ROM
Memory Width 4
Number of Functions 1
Number of Terminals 24
Number of Words 1024 words
Number of Words Code 256
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 256X4
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED
Package Code DIP
Package Equivalence Code DIP24,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Screening Level 38535Q/M;38534H;883B
Seated Height-Max 5.08 mm
Supply Current-Max 0.185 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology BIPOLAR
Temperature Grade MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 7.62 mm
Base Number Matches 1

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