AM27S33DCB vs 53S441J883B feature comparison

AM27S33DCB Rochester Electronics LLC

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53S441J883B Monolithic Memories (RETIRED)

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC MONOLITHIC MEMORIES
Package Description DIP,
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 55 ns 80 ns
JESD-30 Code R-GDIP-T18 R-GDIP-T18
Length 22.86 mm
Memory Density 4096 bit 262144 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 4 8
Number of Functions 1 1
Number of Terminals 18 18
Number of Words 1024 words 1024 words
Number of Words Code 1000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 75 °C 125 °C
Operating Temperature-Min -55 °C
Organization 1KX4 32KX8
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 5.08 mm
Supply Current-Max 0.145 mA
Supply Voltage-Max (Vsup) 5.25 V 3.6 V
Supply Voltage-Min (Vsup) 4.75 V 2.7 V
Supply Voltage-Nom (Vsup) 5 V 3 V
Surface Mount NO NO
Technology BIPOLAR CMOS
Temperature Grade COMMERCIAL EXTENDED MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm
Base Number Matches 2 1
Rohs Code No
JESD-609 Code e0
Package Equivalence Code DIP18,.3
Qualification Status Not Qualified
Screening Level 38535Q/M;38534H;883B
Terminal Finish TIN LEAD

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