AM27S32AFC vs AM27S33DC feature comparison

AM27S32AFC AMD

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AM27S33DC Rochester Electronics LLC

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer ADVANCED MICRO DEVICES INC ROCHESTER ELECTRONICS LLC
Part Package Code DFP
Package Description DFP, FL18,.3 DIP,
Pin Count 18
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 25 ns 55 ns
JESD-30 Code R-CDFP-F18 R-GDIP-T18
JESD-609 Code e0
Length 9.779 mm 22.86 mm
Memory Density 1048576 bit 4096 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 4
Number of Functions 1 1
Number of Terminals 18 18
Number of Words 1024 words 1024 words
Number of Words Code 128000 1000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 75 °C 75 °C
Operating Temperature-Min
Organization 128KX8 1KX4
Output Characteristics OPEN-COLLECTOR
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
Package Code DFP DIP
Package Equivalence Code FL18,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified
Seated Height-Max 2.286 mm 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V 5.25 V
Supply Voltage-Min (Vsup) 4.5 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology BIPOLAR BIPOLAR
Temperature Grade COMMERCIAL EXTENDED COMMERCIAL EXTENDED
Terminal Finish TIN LEAD
Terminal Form FLAT THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Width 9.525 mm 7.62 mm
Base Number Matches 1 2
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Current-Max 0.14 mA
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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