AM27S32AFC
vs
AM27S33DC
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
ROCHESTER ELECTRONICS LLC
|
Part Package Code |
DFP
|
|
Package Description |
DFP, FL18,.3
|
DIP,
|
Pin Count |
18
|
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.71
|
8542.32.00.71
|
Access Time-Max |
25 ns
|
55 ns
|
JESD-30 Code |
R-CDFP-F18
|
R-GDIP-T18
|
JESD-609 Code |
e0
|
|
Length |
9.779 mm
|
22.86 mm
|
Memory Density |
1048576 bit
|
4096 bit
|
Memory IC Type |
OTP ROM
|
OTP ROM
|
Memory Width |
8
|
4
|
Number of Functions |
1
|
1
|
Number of Terminals |
18
|
18
|
Number of Words |
1024 words
|
1024 words
|
Number of Words Code |
128000
|
1000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
75 °C
|
75 °C
|
Operating Temperature-Min |
|
|
Organization |
128KX8
|
1KX4
|
Output Characteristics |
OPEN-COLLECTOR
|
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, GLASS-SEALED
|
Package Code |
DFP
|
DIP
|
Package Equivalence Code |
FL18,.3
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
FLATPACK
|
IN-LINE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
2.286 mm
|
5.08 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.25 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.75 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
NO
|
Technology |
BIPOLAR
|
BIPOLAR
|
Temperature Grade |
COMMERCIAL EXTENDED
|
COMMERCIAL EXTENDED
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
FLAT
|
THROUGH-HOLE
|
Terminal Pitch |
1.27 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
9.525 mm
|
7.62 mm
|
Base Number Matches |
1
|
2
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Supply Current-Max |
|
0.14 mA
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare AM27S32AFC with alternatives